منابع مشابه
Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
متن کاملLead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
متن کاملThe Impact of Reflowing A Pbfree Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfr...
متن کاملExperimental and mechanical characterizations of a lead free solder alloy for electronic devices
Electronic power modules devices are paramount components in the aeronautical, automotive and military applications. The solder layers are the most critical parts of the module and are usually subjected in their whole life to complex loading conditions. To improve the design task, realistic thermoelastoviscoplastic and lifetime prediction models which can describe efficiently the deformation-da...
متن کاملLead-free Solder Assembly: Impact and Opportunity
There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as t...
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ژورنال
عنوان ژورنال: Journal of Nanomaterials
سال: 2011
ISSN: 1687-4110,1687-4129
DOI: 10.1155/2011/919853